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fn8137 rev 5.00 page 1 of 17 september 1, 2015 fn8137 rev 5.00 september 1, 2015 x60003 precision sot-23 fga? voltage references datasheet the x60003 fga? voltage referenc es is a very high precision analog voltage reference fabric ated in intersil?s proprietary floating gate analog technolo gy, which achieves superior levels of performance when compared to conventional band gap, buried zener, or x fet ? technologies. fga? voltage references feature very high initial accuracy, very low temperature coefficient, excellent long term stability, low noise and excellent line and load regulation, at the lowest power consumption currently available. these voltage references enable advanced applications for precision industrial and portable system s operating at significantly higher accuracy and lower power levels than can be achieved with conventional technologies. applications ? high resolution a/ds and d/as ? digital meters ? calibration systems ?v-f converters ? precision current sources ?precision regulators ? precision oscillators ?smart sensors ? strain gage bridges ? threshold detectors ? battery management systems ? servo systems features ? reference output voltage . . . . . . . . . . . . . . . . 4.096v, 5.000v ? initial accuracy . . . . . . . . . . . . . . . . . . . . . . . 1.0mv (b grade) ? ultra low power supply current . . . . . . . . . . . . . . . . . . . . 500na ? low temperature coefficient (b grade) . . . . . . . . . 10ppm/c ? 10ma source and sink current capability ? very low dropout voltage. . . . . . . . . . . . . . 100mv at no load ? input voltage range - x60003-41 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5v to 9.0v - x60003-50 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1v to 9.0v ? 5kv esd (human body model) ? standard package . . . . . . . . . . . . . . . . . . . . . . . . . 3 ld sot-23 ? temp range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40c to +85c related literature ? see an1494 , ?reflow and pc board assembly effects on intersil fga references? ? see an1533 , ?x-ray effects on intersil fga references? figure 1. i in vs v in (3 units) 200 300 400 500 600 700 800 4.0 5.0 6.0 7.0 8.0 9.0 v in (v) i n (na) high typ low
x60003 fn8137 rev 5.00 page 2 of 17 september 1, 2015 available options pin configuration x60003 (3 ld sot-23) top view typical application circuit part number v out option (v) initial accuracy (mv) tempco. (ppm/c) X60003BIG3Z-41T1 4.096 1.0 10 x60003cig3z-41t1 4.096 2.5 20 x60003dig3z-41t1 (no longer available or supported) 4.096 5.0 20 x60003big3z-50t1 5.000 1.0 10 x60003cig3z-50t1 5.000 2.5 20 x60003dig3z-50t1 5.000 5.0 20 pin descriptions pin number pin name description 1v in power supply input connection 2v out voltage reference output connection 3 gnd ground connection 1 2 3 v out gnd v in figure 2. typical application precision 16 to 24-bit a/d converter v in = +5.0v 0.1f serial bus v in v out gnd x60003 enable sck sdat a/d converter 16 to 24-bit ref in 10f 0.001f
x60003 fn8137 rev 5.00 page 3 of 17 september 1, 2015 ordering information part number (notes 2, 3) part marking (note 4) v out (v) grade (c) temp. range (c) package (rohs compliant) pkg. dwg # X60003BIG3Z-41T1 (note 1) apf 4.096 1.0mv, 10ppm -40 to +85 3 ld sot-23 p3.064 x60003cig3z-41t1 (note 1) aph 2.5mv, 20ppm -40 to +85 3 ld sot-23 p3.064 x60003dig3z-41 (no longer available, recommended replacement: X60003BIG3Z-41T1) apj 5.0mv, 20ppm -40 to +85 3 ld sot-23 p3.064 x60003dig3z-41t1 (note 1) (no longer available, recommended replacement: X60003BIG3Z-41T1) apj 5.0mv, 20ppm -40 to +85 3 ld sot-23 p3.064 x60003big3z-50t1 (note 1) apg 5.00 1.0mv, 10ppm -40 to +85 3 ld sot-23 p3.064 x60003cig3z-50t1 (note 1) api 2.5mv, 20ppm -40 to +85 3 ld sot-23 p3.064 x60003dig3z-50t1 (note 1) apk 5.0mv, 20ppm -40 to +85 3 ld sot-23 p3.064 x60003-evalz evaluation board notes: 1. please refer to tb347 for details on reel specifications. 2. these intersil pb-free plastic packaged products employ spec ial pb-free material sets, molding compounds/die attach materials , and 100% matte tin plate plus anneal (e3 termination finish , which is rohs compliant and compatible wi th both snpb and pb-free soldering opera tions). intersil pb-free products are msl classified at pb-fr ee peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jed ec j std-020. 3. for moisture sensitivity level (msl), please see device information page for x60003 . for more information on msl please see techbrief tb363 . 4. the part marking is located on the bottom of the part
x60003 fn8137 rev 5.00 page 4 of 17 september 1, 2015 absolute voltage ratings thermal information max voltage applied v in to gnd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to +10v v out to gnd (10s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to +5.1v esd ratings human body model (tested to jesd22-a114) . . . . . . . . . . . . . . . . . . 5kv machine model (tested to jesd22-a115) . . . . . . . . . . . . . . . . . . . . . 500v latch up (tested per jesd-78b; class 2, level a) . . . . . . . . . . . . . . 100ma environmental operating conditions x-ray exposure (note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mrem thermal resistance (typical) ? ja (c/w) ? jc (c/w) 3 lead sot-23 (notes 6, 7) . . . . . . . . . . . . . . 275 110 maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+107c storage temperature range. . . . . . . . . . . . . . . . . . . . . . . .-65c to +125c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see tb493 recommended operating conditions temperature range (industrial) . . . . . . . . . . . . . . . . . . . . . . -40c to +85c caution: do not operate at or near the maximum ratings listed for extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. important note: all parameters having min/max specifications ar e guaranteed. typ values are for information purposes only. unle ss otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: t j = t c = t a notes: 5. measured with no filtering, distance of 10? from source, in tensity set to 55kv and 70ma current, 30s duration. other exposure levels should be analyzed for output voltage drift effects. see ?applications information? on page 12. 6. ? ja is measured with the component mounted on a high effective thermal conductivity test board in free air. see tech brief tb379 for details. 7. for ? jc , the ?case temp? location is taken at the package top center. 8. post-reflow drift for the x60003 devices will range from 100v to 1.0mv based on experimental re sults with devices on fr4 dou ble sided boards. the design engineer must take this into account wh en considering the reference voltage after assembly. electrical specifications operating conditions: i out = 0ma, c out = 0.001f, t a = -40 to +85c. boldface limits apply over the operating temperature range, -40c to +85c. symbol parameter conditions min (note 12) typ max (note 12) units v oa v out accuracy @ t a = +25c x60003b -1.0 +1.0 mv x60003c -2.5 +2.5 mv x60003d -5.0 +5.0 mv i in supply current 500 900 na tc v out output voltage temperature coefficient (note 9) x60003b 10 ppm/c x60003c 20 ppm/c x60003d 20 ppm/c v n output voltage noise 0.1hz to 10hz 30 v p-p i sc short circuit current t a = +25c 50 80 ma electrical specifications (x60003-41) v in = 5.0, t a = -40c to +85c, unless otherwise specified. boldface limits apply over the operating temperature range, -40c to +85c. symbol parameter conditions min (note 12) typ max (note 12) units v in input voltage range 4.5 9.0 v v out output voltage 4.096 v ? v out / ? v in line regulation +4.5v ? v in ? +8.0v 150 v/v ? v out / ? i out load regulation sourcing: 0ma ? i source ? 10ma 10 50 v/ma sinking: -10ma ? i sink ? 0ma 20 100 v/ma ? v out / ? t a thermal hysteresis (note 10) ? t = -40c to +85c 150 ppm ? v out / ? t long term stability (note 11) t a = +25c 50 ppm
x60003 fn8137 rev 5.00 page 5 of 17 september 1, 2015 electrical specifications (x60003-50) v in = 6.5v, t a = -40c to +85c, unless otherwise specified. boldface limits apply over the operating temperature range, -40c to +85c. symbol parameter conditions min (note 12) typ max (note 12) units v in input voltage range 5.1 9.0 v v out output voltage 5.000 v ? v out / ? v in line regulation +5.5v ? v in ? +8.0v 150 v/v ? v out / ? i out load regulation sourcing: 0ma ? i source ? 10ma 10 50 v/ma sinking: -10ma ? i sink ? 0ma 20 100 v/ma v do dropout voltage i out = 5ma, ? v out = -0.01% 150 300 mv ? v out / ? t a thermal hysteresis (note 10) ? t = -40c to +85c 100 ppm ? v out / ? t long term stability (note 11) t a = +25c 45 ppm notes: 9. over the specified temperature range. temperature coefficien t is measured by the box method whereby the change in v out is divided by the temperature range; in this case, -40c to +85c = +125c. 10. thermal hysteresis is the change of v out measured at t a = +25c after temperature cycling over a specified range, ? t a . v out is read initially at t a = +25c for the device under test. the devi ce is temperature cycled and a second v out measurement is taken at +25c. the difference between the initial v out reading and the second v out reading is then expressed in ppm. for ? t a = +125c, the device under test is cycled from +25c to +85c to -40c to +85c. 11. long term drift is logarithmic in natu re and diminishes over time. drift after the first 1000 hours will be approximately 10 ppm/sqrt(1khrs). 12. parameters with min and/or max limits are 100% tested at +25c, unless otherwise specified. temperature limits established b y characterization and are not production tested.
x60003 fn8137 rev 5.00 page 6 of 17 september 1, 2015 typical performance curves (x60003-41) vin = 5.0v, iout = 0ma, ta = +25c unless otherwise specified . figure 3. i in vs v in (3 units) figure 4. i in vs v in figure 5. vout vs temperature normalized to +25c (3 units) figure 6. line regulation (3 units) figure 7. line regulation over-temperature 200 300 400 500 600 700 800 4.0 5.0 6.0 7.0 8.0 9.0 v in (v) i n (na) high typ low v in (v) i n (na) 350 400 450 500 550 600 4.0 5.0 6.0 7.0 8.0 9.0 +85c +25c -40c 4.0940 4.0945 4.0950 4.0955 4.0960 4.0965 4.0970 4.0975 -40 -15 10 35 60 85 temperature (c) v out (v) typ high low v in (v) v out (v) (normalized to 4.096v at vout) 4.0955 4.0957 4.0959 4.0961 4.0963 4.0965 4.0967 4.0969 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 unit 2 unit 1 unit 3 v in (v) ? v out (v) (normalized to vi n = 5.0v) -100 -50 0 50 100 150 200 250 300 350 4.55.05.56.06.57.07.58.0 8.5 9.0 +85c +25c -40c
x60003 fn8137 rev 5.00 page 7 of 17 september 1, 2015 figure 8. line transient re sponse, no capacitive load figure 9. line transient response, 0.001f load capacitance figure 10. psrr vs cap load figure 11. load regulation figure 12. load transient response figure 13. load transient response typical performance curves (x60003-41) vin = 5.0v, iout = 0ma, ta = +25c unless otherwise specified . (continued) c l = 0nf ? v in = -500mv ? v in = 500mv 500sec/div 200mv/div c l = 1nf ? v in = -500mv ? v in = 500mv 500sec/div 200mv/div -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 10 100 1k 10k 100k 1m frequency (hz) psrr (db) no load 1nf load 10nf load 100nf load -0.30 -0.20 -0.10 0.00 0.10 0.20 0.30 -20 -15 -10 -5 0 5 10 15 20 output current (ma) sinking sourcing ? v out (mv) +85c -40c +25c c l = 1nf 100sec/div 50mv/div i l = -50a i l = 50a c l = 1nf 500sec/div 200mv/div i l = -10ma i l = 10ma
x60003 fn8137 rev 5.00 page 8 of 17 september 1, 2015 figure 14. turn-on time (+25c) figure 15. z out vs frequency figure 16. band pass filter with zero at 0.1hz and 2 poles at 10hz typical performance curves (x60003-41) vin = 5.0v, iout = 0ma, ta = +25c unless otherwise specified . (continued) time (ms) v in and v out (v) 0 1 2 3 4 5 6 -11357911 v in v out 0 50 100 150 200 1 10 100 1k 10k 100k frequency (hz) z out ( ? ) 1nf load no load 10nf load 100nf load 0.1hz to 10hz v out noise 10s/div 10v/div
x60003 fn8137 rev 5.00 page 9 of 17 september 1, 2015 typical performance curves (x60003-50) (v in = 6.5v, i out = 0ma, t a = +25c unless otherwise specified) figure 17. line regulation figure 18. line regulation (3 units) figure 19. load regulation over temperature figure 20. band pass filter with zero at 0.1hz and 2 poles at 10hz figure 21. v out vs temperature (3 units) figure 22. pssr vs cap load +25c +85c -40c v in (v) ? v out (v) (normailized to v in = 6.5v) -50 -25 0 25 50 75 100 125 150 579 6 8 v in (v) (normailized to 5v at v in = 6.5v 4.9997 4.9998 4.9999 5.0000 5.0001 5.0002 5.0003 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 unit 3 unit 1 unit 2 ? dv out (v) -0.40 -0.20 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 -20 -15 -10 -5 0 5 10 15 20 sinking output current (ma) sourcing ? v out (mv) +85c +25c -40c 0.1hz to 10hz v out noise 1s/div 10v/div 4.9980 4.9985 4.9990 4.9995 5.0000 5.0005 5.0010 5.0015 5.0020 5.0025 -40 -15 10 35 60 85 temperature (c) v out (v) unit 3 unit 1 unit 2 frequency (hz) psrr (db) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 10 100 1k 10k 10k 1m no load 1nf load 10nf load 100nf load
x60003 fn8137 rev 5.00 page 10 of 17 september 1, 2015 figure 23. 10ma load transient response figure 24. 50a load transient response figure 25. line transient response figure 26. line transient response figure 27. minimum v in to v out differential vs output current typical performance curves (x60003-50) (v in = 6.5v, i out = 0ma, t a = +25c unless otherwise specified) (continued) c l = 0.001f i in = -10ma 2ms/div 500mv/div i in = +10ma c l = 0.001f i in = -50a 500s/div 100mv/div i in = +50a c l = 0 v in = -500mv v in = 500mv 200mv/div 500sec/div v in = -500mv v in = 500mv 200mv/div 500sec/div c l = 0.001f output current (sourcing ma) v in to v out differential (v) 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 06810 24 +85c +25c -40c
x60003 fn8137 rev 5.00 page 11 of 17 september 1, 2015 figure 28. z out vs frequency figure 29. i in vs v in figure 30. i in vs v in (3 units) figure 31. turn-on time figure 32. x60003 turn-on time (+25c), 3 units typical performance curves (x60003-50) (v in = 6.5v, i out = 0ma, t a = +25c unless otherwise specified) (continued) frequency (hz) z out () 20 0 40 60 80 100 120 140 160 180 100 10 1 1k 10k 100k no load 100nf load 1nf load 10nf load 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 i in (na) v in (v) 100 0 200 300 400 500 600 700 +85c +25c -40c 800 i in (na) v in (v) low typ high 0 100 200 300 400 500 600 700 800 900 5678910 0 0 4 6 8 10 12 1 2 3 4 5 6 time (ms) v out (v) 2 v out = 5.0v 0 1 2 3 4 5 6 7 04681012 time (ms) v out (v) unit 2 unit 3 unit 1 2
x60003 fn8137 rev 5.00 page 12 of 17 september 1, 2015 applications information fga technology the x60003 voltage references use the floating gate technology to create references with very low drift and supply current. essentially the charge stored on a floating gate cell is set precisely in manufacturing. the reference voltag e output itself is a buffered version of the floating gate voltag e. the resulting reference device has excellent characteristics which are unique in the industry: very low temperature drift, high initial accuracy, and almost zero supply current. also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). the process used for these reference devices is a floating gate cmos process, and the amplifier circuitry uses cmos transistors for amplifier and output transistor circuitry. while providing excellent accuracy, there are limitat ions in output noise level and load regulation due to the mos device characteristics. these limitations are addressed with ci rcuit techniques discussed in other sections. handling and board mounting fga references provide excellent initial accuracy and low temperature drift at the expense of very little power drain. there are some precautions to take to insure this accuracy is not compromised. excessive heat du ring solder reflow can cause excessive initial accuracy drift, so the recommended +260c max temperature profile should not be exceeded. expect up to 1mv drift from the solder reflow process. fga references are susceptible to excessive x-radiation like that used in pc board manufacturing. initial accuracy can change 10mv or more under extreme radi ation. if an assembled board needs to be x-rayed, care should be taken to shield the fga reference device. nanopower operation reference devices achieve their highest accuracy when powered up continuously, and after initia l stabilization has taken place. the x60003 is the first high precision voltage reference with ultra low power consumption that makes it practical to leave power-on continuously in battery operated circuits. the x60003 consume extremely low supply current due to the proprietary fga technology. supply current at room temperature is typically 500na which is 1 to 2 orders of magnitude lower than competitive devices. application circuits using battery power will benefit greatly from having an accurate, stable reference which essentially presents no load to the battery. in particular, battery-powered data converter circuits that would normally require the entire circuit to be disabled when not in use can remain powered-up between conversions as shown in figure 33. data acquisition circuits providing 12 to 24-bits of accuracy can operate with the reference device continuously biased with no power penalty, providing the highest accuracy and lowest possible long term drift. other reference devices consuming higher supply currents will need to be disabled in between conversions to conserve battery capacity. absolute accuracy will suffer as the device is biased and requires time to settle to its final value, or, may not actually settle to a final value as po wer-on time may be short. board mounting considerations for applications requiring the hi ghest accuracy, board mounting location should be reviewed. placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to die stresses. it is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limite d at that location. obviously mounting the device on flexprint or extremely thin pc material will likewise cause loss of reference accuracy. board assembly considerations fga references provide high accuracy and low temperature drift but some pc board assembly pr ecautions are necessary. normal output voltage shifts of 100v to 1mv can be expected with pb-free reflow profiles or wave solder on multi-layer fr4 pc boards. precautions should be ta ken to avoid excessive heat or extended exposure to high reflow or wave solder temperatures, this may reduce device initial accuracy. post-assembly x-ray inspection may also lead to permanent changes in device output voltag e and should be minimized or avoided. if x-ray inspection is required, it is advisable to monitor the reference output voltage to verify excessive shift has not occurred. if large amounts of shift are observed, it is best to add an x-ray shield consisting of thin zinc (300m) sheeting to allow clear imaging, yet block x-ray energy that affects the fga reference. v in = +6v to 9v 0.001f serial bus v in v out gnd x60003 ref in enable sck sdat a/d converter 12 to 24-bit 0.01f 10f figure 33. battery-powered data converter circuits
x60003 fn8137 rev 5.00 page 13 of 17 september 1, 2015 special applications considerations in addition to post-assembly examination, there are also other x- ray sources that may affect the fga reference long term accuracy. airport screening machines contain x-rays and will have a cumulative effect on the voltage reference output accuracy. carry-on luggage screening uses low level x-rays and is not a major source of output volt age shift, although if a product is expected to pass through that type of screening over 100 times it may need to consider shielding with copper or aluminum. checked luggage x-rays are higher intensity and can cause output voltage shift in much fewer passes, so devices expected to go through those machines should definitely consider shielding. note that just two layers of 1/2 ounce copper planes will reduce the received dose by over 90%. the leadframe for the device which is on the bottom also provides similar shielding. if a device is expected to pass through luggage x-ray machines numerous times, it is advised to mount a 2-layer (minimum) pc board on the top, and along with a ground plane underneath will effectively shield it from 50 to 100 passes through the machine. since these machines vary in x-ray dose delivered, it is difficult to produce an accurate maximum pass recommendation. noise performance and reduction the output noise voltage in a 0.1h z to 10hz bandwidth is typically 30v p-p . this is shown in the plot in the ?typical performance curves? on page 8 and 9. the noise measur ement is made wi th a bandpass filter made of a 1-pole high-pass filt er with a corner frequency at 0.1hz and a 2-pole low-pass filter with a corner frequency at 12.6hz to create a filter with a 9.9hz bandwi dth. noise in the 10khz to 1mhz bandwidth is approximately 400v p-p with no capacitance on the output, as shown in figure 34. th ese noise measurements are made with a 2 decade bandpass filter made of a 1-pole high-pass filter with a corner frequency at 1/10 of the center frequency and 1-pole low-pass filter with a corner frequency at 10x the center frequency. figure 34 also shows the noise in the 10khz to 1mhz band can be reduced to about 50v p-p using a 0.001f capacitor on the output. noise in the 1khz to 100khz band can be further reduced using a 0.1f capacitor on the output, but noise in the 1hz to 100hz band increases due to instability of the very low power amplifier with a 0.1f capacitance load. for load capacitances above 0.001f, the noise reduction network shown in figure 35 is recommended. this network reduces noise significantly over the full bandwidth. figure 35 shows that noise is reduced to less than 40v p-p from 1hz to 1mhz using this network with a 0.01f capacitor and a 2k ? resistor in series with a 10f capacitor. turn-on time the x60003 device has ultra-low supply current and thus the time to bias-up internal circuitry to final values will be longer than with higher power references. normal turn-on time is typically 7ms. this is shown in the graph, figure 32. since devices can vary in supply current down to 300na, turn-on time can last up to about 12ms. care should be take n in system design to include this delay before measurements or conversions are started. temperature coefficient the limits stated for temperature coefficient (tempco) are governed by the method of measurement. the overwhelming standard for specifying the temperature drift of a reference is to measure the reference voltage at two temperatures, take the total variation (v high -v low ), and divide by the temperature extremes of measurement (t high - t low ). the result is divided by the nominal reference voltage (at t = +25c) and multiplied by 10 6 to yield ppm/c. this is the ?box? method for determining temperature coefficient. 400 350 300 250 200 150 100 50 0 1 10 100 1k 10k 100k noise voltage (v p-p ) figure 34. x60003 noise reduction cl = 0 cl = 0.001f cl = 0.1f cl = 0.01f and 10f + 2k ? v in = 6.5v v in v o gnd x60003 0.01f 10f 2k ? 0.1f 10f figure 35. noise reduction network
x60003 fn8137 rev 5.00 page 14 of 17 september 1, 2015 typical application circuits figure 36. precision 5v, 50ma reference figure 37. 5.0v dual output , high accuracy reference figure 38. kelvin sensed load 6.0v to 9.0v 2n2905 5.0v/50ma 0.001f v in v out gnd x60003 r = 200 ? v in v out gnd gnd v in v out x60003 0.1f 0.001f 5.0v 0.001f r 1 5.5v to 9.0v v in = -5.5v to -9.0v -5.0v ; i out 10ma 5.0v - | v in | r 1 = -(i out ) x60003-41 0.1f 5.5v to 9.0v v in v out gnd v out sense load + C x60003
x60003 fn8137 rev 5.00 page 15 of 17 september 1, 2015 revision history the revision history provided is for informational purposes only and is believed to be accurate, but not warranted. please go t o web to make sure you have the latest rev. date revision change september 1, 2015 fn8137.5 updated ordering information table on page 3. june 23, 2014 fn8137.4 updated pod with following changes: in detail a, changed lead width dimension from 0.13+/-0.05 to 0.085-0.19 changed dimension of foot of lead from 0.31+/-0.10 to 0.38+/-0.10 in land pattern, added 0.4 rad typ dimension in side view, changed height of package from 0.91+/-0.03 to 0.95+/-0.07 march 31, 2010 fn8137.3 throughout- converted to new format. changes made as follows: moved ?available options?, ?pin configura tion? and ?pin descriptions? to page 2 added ?related literature? on page 1 added key selling feature graphic figure 1 to page 1 added msl note to ?ordering information? table on page 3 added "boldface limits apply..." note to common conditions of electrical specifications tables on page 4 and page 5. bolded applicable specs. added note 12 to min max columns of all electrical specifications tables. added latch up to ?absolute voltage ratings? on page 4 added junction temperature to ?thermal information? on page 4 added jedec standards used at the time of testing for ?esd ratings? on page 4 added ?revision history? on page 15 and ?about intersil? on page 16 updated package outline drawing on page 17 to new format by adding land pattern and moving dimensions from table onto drawing removed retired devices from ?ordering information? table on page 3 and ?available options? on page 2 as follows: x60003big3-41t1 x60003cig3-41t1 x60003dig3-41t1 x60003big3-50t1 x60003cig3-50t1 x60003dig3-50t1 added the following to page 4: "environmental operating conditions x-ray exposure (note 4)..........10mrem note 4. measured with no filtering, distance of 10? from source, intensity set to 55kv and 70ma current, 30s duration. other exposure levels should be analyzed for output voltag e drift effects. see ?applications information? on page 10. ?thermal information? on page 4: changed theta ja from 202.70 to 375. added theta jc of 110 and applicable note (measured at top of package). in figures 1, 3, 5 and 30, changed the color to dark blue (unit 3), black (unit 2), and dark green (unit 1). changed name of unit 3 to high, unit 2 to typ and unit 1 to low. figure 4. changed the colors to dark blue (85), black (25), and dark green (-40). figure 29. increased the y-axis to 800na. added ?handling and board mounting? on page 12
fn8137 rev 5.00 page 16 of 17 september 1, 2015 x60003 intersil products are manufactured, assembled and tested utilizing iso9001 quality systems as noted in the quality certifications found at www.intersil.com/en/suppor t/qualandreliability.html intersil products are sold by description on ly. intersil may modify the circuit design an d/or specifications of products at any time without notice, provided that such modification does not, in intersil's sole judgment, affect the form, fit or function of the product. accordingly, the reader is cautioned to verify that datasheets are current before placing orders. information fu rnished by intersil is believed to be accu rate and reliable. however, no responsib ility is assumed by intersil or its subsidiaries for its use; nor for any infrin gements of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com for additional products, see www.intersil.com/en/products.html ? copyright intersil americas ll c 2005-2017. all rights reserved. all trademarks and registered trademarks are the property of their respective owners. about intersil intersil corporation is a leading provider of innovative power ma nagement and precision analog so lutions. the company's product s address some of the largest markets within the industrial and infrastr ucture, mobile computing and high-end consumer markets. for the most updated datasheet, application notes, related documentatio n and related parts, please see the respective product information page found at www.intersil.com . you may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask . reliability reports are also av ailable from our website at www.intersil.com/support.
x60003 fn8137 rev 5.00 page 17 of 17 september 1, 2015 package outline drawing p3.064 3 lead small outline transistor plastic package (sot23-3) rev 3, 3/12 reference jedec to-236. footlength is measured at reference to gauge plane. dimension does not include interlead flash or protrusions. dimensioning and tolerancing conform to amsey14.5m-1994. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: detail "a" side view typical recommended land pattern top view c 0.10 c 0.20 m c l c 1.300.10 c l 0.950 2.370.27 2.920.12 4 4 10 typ (2 plcs) 0.013(min) 0.100(max) seating plane 1.000.12 0.950.07 seating plane gauge plane 0.25 0.380.10 detail "a" 0.4350.065 0 - 8 deg. (2.15) (1.25) (0.60) (0.95 typ.) 5 0 . 0 8 5 - 0 . 1 9 dimensions in ( ) for reference only. interlead flash or protrusions shall not exceed 0.25mm per side . (0.4 rad typ.)

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